Board for hybrid integrated circuit

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29846, 174255, 174257, 174258, H05K 100

Patent

active

050361678

ABSTRACT:
A hybrid integrated circuit comprising a ceramic substrate, a copper plate having a thickness of 1 to 100 .mu.m formed by adhering a copper material to the ceramic substrate, an insulating layer having a thickness of 10 to 100 .mu.m formed on said copper plate by means of screen printing, and a wiring layer having a thickness of 5 to 80 .mu.m formed on said insulating layer by means of screen printing, and a method for manufacturing the same.

REFERENCES:
patent: 3549784 (1970-12-01), Hargis
patent: 4525383 (1985-06-01), Saito
patent: 4569902 (1986-02-01), Saito
patent: 4641425 (1987-02-01), Dubuission et al.
patent: 4687540 (1987-08-01), Singhdeo et al.
patent: 4713494 (1987-12-01), Oikawa et al.
patent: 4715117 (1987-12-01), Enomoto
patent: 4725333 (1988-02-01), Leedecke et al.
patent: 4835038 (1989-05-01), Kaneko et al.
Matsuzaki et al., "High-Density Multilayer Wiring Substrate Using Copper Thick Film and Thin Film", Electronic Components Conference, Washington, DC, May 1985, pp. 484-491.
Patent Abstracts of Japan, vol. 3, No. 106 (E-135), Sep. 7, 1979; & JP-A-54 82 700 (NEC Corp.) 02-07-1979.
"New Generation Hybrid Technology", Electronic Materials, Kogyo Chosakai, May 1984, pp. 57 to 60.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Board for hybrid integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Board for hybrid integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Board for hybrid integrated circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1543370

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.