Board for electronic device, electronic device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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C257S052000, C257S054000, C257S646000, C347S068000

Reexamination Certificate

active

06984843

ABSTRACT:
A board for an electronic device is provide comprising a substrate having an amorphous layer, a buffer layer formed on the amorphous layer, the buffer layer having an orientation at least in the direction of its thickness, and a conductive oxide layer formed on the buffer layer by means of epitaxial growth, the conductive oxide layer having a metal oxide of a perovskite structure. The buffer layer contains at least one of the group consisting of a metal oxide of a NaCl structure and a metal oxide of a fluorite structure. Furthermore, the buffer layer12is formed by epitaxial growth in the cubic crystal (100) orientation.

REFERENCES:
patent: 5650378 (1997-07-01), Iijima et al.
patent: 5801105 (1998-09-01), Yano et al.
patent: 5838035 (1998-11-01), Ramesh
patent: 6258472 (2001-07-01), Neumuller et al.
patent: 6303042 (2001-10-01), Hawkins et al.
patent: 6555946 (2003-04-01), Finder et al.
patent: 6563118 (2003-05-01), Ooms et al.
patent: 6737690 (2004-05-01), Higuchi et al.
patent: 6747317 (2004-06-01), Kondo et al.
patent: 6869170 (2005-03-01), Shimada et al.
patent: 2002/0082171 (2002-06-01), Schoop et al.
patent: 06-145977 (1994-05-01), None
patent: 6-145977 (1994-05-01), None
patent: 07-065642 (1995-03-01), None
patent: 07-286897 (1995-10-01), None
patent: 2614948 (1997-02-01), None
patent: 2670391 (1997-07-01), None
patent: 09-256152 (1997-09-01), None
patent: 10-121238 (1998-05-01), None
patent: 10-231122 (1998-09-01), None
patent: 11-049599 (1999-02-01), None
patent: 11-185544 (1999-07-01), None
patent: 2000-203836 (2000-07-01), None
patent: 2001-114594 (2001-04-01), None
patent: 2001-506411 (2001-05-01), None
patent: 2001-152324 (2001-06-01), None
Hontsu et al. , Al Films layers for High-Temperature Superconducting Thin Films on Amorphous Substrates, IEEE Transactions On Applied Superconductivity, vol. 9, No. 2, Jun. 1999, pp. 1669-1672.
Chiba et al. , The Effect of Lattice Matching between Buffer Layer and YBa2Cu3O7 Thin Film on In-Plane Alignment of C-axis Orientated Thin Films, IEEE Transactions On Applied Superconductivity, vol. 11, No. 1, Mar. 2001, pp. 2734-2737.
Lock See Yu, James M.E. Harper, Jerome J. Cuomo and David A. Smith, “Alignment of thin films by glancing angle ion bombardment during deposition”: 1985.
European Search Report from corresponding Application No. 03006728.4-2304.

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