Board connector module for mezzanine circuit board assemblies

Details Board connector module for mezzanine circuit board assemblies Board connector module for mezzanine circuit board assemblies

2011-01-04

2011-01-04

Duverne, Jean F (Department: 2839)

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

Reexamination Certificate

active

07862387

ABSTRACT:
The invention relates to a board connector module including a frame accommodating an array of substantially-parallel signal leads (S) and ground leads (G) extending in a longitudinal direction (L). The said frame includes edges extending substantially parallel to said leads and one or more transverse bars extending between said edges. The transverse bars of the frame may resist deflection or buckling of these leads and consequently allow for higher stack heights in mezzanine circuit board assemblies.

REFERENCES:
patent: 4506215 (1985-03-01), Coughlin
patent: 4609243 (1986-09-01), Wyss
patent: 4622514 (1986-11-01), Lewis
patent: 4901013 (1990-02-01), Benedetto et al.
patent: 5415556 (1995-05-01), Schroll
patent: 6404211 (2002-06-01), Hamel et al.
patent: 6417684 (2002-07-01), Schmid et al.
patent: 6424164 (2002-07-01), Kister
patent: 6530148 (2003-03-01), Kister
patent: 6595788 (2003-07-01), Harper et al.
patent: 7271602 (2007-09-01), Tunaboylu et al.
patent: 2004/0171310 (2004-09-01), Harper, Jr. et al.
patent: 0 582 264 (1994-02-01), None
patent: 63-266787 (1988-11-01), None
“High Density Parallel Board”, © IBM Corp., 1991, XP-000282537, pp. 160-163.

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