Blow molding apparatus for a chip carrier maker

Plastic article or earthenware shaping or treating: apparatus – Preform reshaping or resizing means: or vulcanizing means... – Including both heating and cooling means

Patent

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Details

264544, 4253871, 425388, B29C 5110, B29C 5142

Patent

active

059651741

ABSTRACT:
A blow molding apparatus for a chip carrier maker is adapted to form a longitudinal row of spaced-apart recesses in a flat thermoplastic strip and includes a stationary machine frame, a heating device mounted on the frame for heating the strip, a lower mold disposed on the frame and having a mold cavity unit therein, and an upper mold which is disposed on the frame. One of the upper and lower molds can be moved toward the other one so as to clamp the strip between the upper and lower molds, thereby establishing an air-tight seal between the strip and the upper mold. The upper mold has a bottom surface formed with an air chamber, and an air passage unit which is formed therethrough and which is in fluid communication with the air chamber so that compressed air can be introduced into the air chamber via the air passage unit, thereby pressing the strip into the mold cavity unit after the strip is heated and softened by the heating device and subsequently forming the recesses in the strip. The heating device includes a heating member fixed in the air chamber to heat air in the air chamber to a temperature at which the strip is softened. The upper mold includes an upper cooling unit located around the air chamber to cool the upper mold after the recesses are formed in the strip.

REFERENCES:
patent: 3137747 (1964-06-01), Kline
patent: 3193599 (1965-07-01), Crilly
patent: 3396062 (1968-08-01), White
patent: 3476840 (1969-11-01), Glassford
patent: 3533352 (1970-10-01), Miller
patent: 3664791 (1972-05-01), Brown
patent: 5192484 (1993-03-01), Matuzawa et al.
patent: 5648136 (1997-07-01), Bird
patent: 5800772 (1998-09-01), Kurasawa

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