Block copolymer hot melt adhesive compositions

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

260 37N, C08K 714, C08K 718

Patent

active

042194598

ABSTRACT:
Hot melt adhesive compositions comprising a block copolymer, particulate mineral reinforcing agent, glass fiber and hollow inorganic silicate microspheres. The block copolymer is selected from the group consisting of copolyesters, copolyamides, copoly(esteramides) and copoly(ether-esters) melting at a temperature above about 150.degree. C. and having from about 30 to about 70 weight percent of hard segments and from about 70 to about 30 weight percent of soft segments. The weight ratio of block copolymer to particulate inorganic reinforcing agent, glass fiber and silicate microspheres is in the range of about 3:7 to about 3:2, the weight ratio of block copolymer to glass fiber is at least about 3:4, the weight ratio of particulate mineral to glass fiber is in the range of about 1:3 to about 9:1 and the volume percentage of hollow inorganic silicate microspheres is less than about 12. The compositions are particularly useful for filling voids and cavities in substrates.

REFERENCES:
patent: 3650999 (1972-03-01), Martins et al.
patent: 3859251 (1975-01-01), Kuhfuss et al.
patent: 4073973 (1978-02-01), Martins et al.
patent: 4097445 (1978-06-01), Martins et al.
Philadelphia Quartz Co. (PQ Corp.), Product Bulletin QC-2B (3-1-77), "Q-Cel Microspheres . . . ".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Block copolymer hot melt adhesive compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Block copolymer hot melt adhesive compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Block copolymer hot melt adhesive compositions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1304915

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.