Blister package

Details Blister package Blister package

2008-01-24

2011-12-20

Pickett, J. Gregory (Department: 3788)

Special receptacle or package

For ampule, capsule, pellet, or granule

With rupture means for access

C206S531000, C206S528000, C206S538000, C229S237000

Reexamination Certificate

active

08079475

ABSTRACT:
A blister package is provided for retaining individual product units. The blister package is formed by a receptacle substrate and an outer laminate. The receptacle substrate includes a sealing flange and one or more receptacle hollows for retaining product therein. The outer laminate includes a first layer covering a sealing layer, with the sealing layer bonded to the receptacle flange and covering the product within the hollows. A repeating score line pattern is formed in the outer laminate for promoting a tear in the laminate upon forcing the product from the receptacle hollow against the outer laminate. The score pattern extends substantially across the area of the outer laminate covering the receptacle hollow and includes a plurality of spaced score lines formed in a crosswise relationship.

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