Blister-free direct bonding of metals to ceramics and metals

Details Blister-free direct bonding of metals to ceramics and metals Blister-free direct bonding of metals to ceramics and metals

1981-04-16

1983-10-11

Ramsey, Kenneth J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

228124, 228174, 228198, 428167, 428178, 428577, 428586, 428675, B23K 112

Patent

active

044092784

ABSTRACT:
Large-area, blister-free assemblies of direct-bonded metal to a ceramic or metal substrate are obtained by providing venting channels in the metal-substrate interface. The channels may be formed in the metal or substrate surface to be bonded. The channels in the metal may be formed by etching, while the channels in the ceramic may be formed by mechanical techniques, such as grinding. The metal-to-substrate direct bond may be formed by any conventional processes employing an eutectic melt composition to bond the metal to the substrate.

REFERENCES:
patent: 3284176 (1966-11-01), Reed et al.
patent: 3337947 (1967-08-01), Terrill et al.
patent: 3541225 (1970-11-01), Raciti
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3911553 (1975-10-01), Burgess et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4061263 (1977-12-01), Ohlstein
Sun et al, Article in IEEE Transactions on Electron Devices, vol. ED-23, No. 8, Aug. 1976, pp. 961-967.

Affiliated with

Also associated with

Rating

Blister-free direct bonding of metals to ceramics and metals does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Blister-free direct bonding of metals to ceramics and metals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Blister-free direct bonding of metals to ceramics and metals will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1275481