Blind hole termination of pin to pcb

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S785000, C257S774000, C439S083000, C438S620000

Reexamination Certificate

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06963494

ABSTRACT:
Tails (20) projecting from an electrical component (12) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board (14) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and plated in a first layer (31) that will become the topmost layer of the stack, to form a shallow well (70). The well is filled with a soldering composition (130). A tail (20) is projected downward into the soldering composition, and the soldering composition is heated to solder the tail to the hole plating.

REFERENCES:
patent: 3301939 (1967-01-01), Krasnow
patent: 3875479 (1975-04-01), Jaggar
patent: 5046957 (1991-09-01), Millhimes
patent: 5363280 (1994-11-01), Chobot et al.
patent: 5543586 (1996-08-01), Crane et al.
patent: 6522014 (2003-02-01), Egitto et al.

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