Blends of polyarylether sulphone and polyamide, with...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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Details

C523S435000, C523S458000, C525S423000, C525S535000

Reexamination Certificate

active

07105591

ABSTRACT:
The thermoplastic molding composition comprises components A, C, D, E and, where appropriate, B, F and G, the total weight of which is 100% by weight, and also component H:a) as component A, from 5 to 94.8% by weight of at least one polyaryl ether sulfone,b) as component B, from 0 to 20% by weight of at least one functionalized polyaryl ether sulfone,c) as component C, from 5 to 94.8% by weight of at least one polyamide,d) as component D, from 0.1 to 10% by weight of at least one epoxy resin,e) as component E, from 0.1 to 60% by weight of fibrous or particulate fillers or a mixture of these,f) as component F, from 0 to 40% by weight of impact-modifying rubbers which have functional groups,g) as component G, from 0 to 40% by weight of other conventional additives and processing aids,h) as component H, from 100 ppm to 0.5% by weight, based on the amounts of components A to G, of copper bromide and/or copper iodide.

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patent: 03273056 (1991-12-01), None
patent: 00/012601 (2000-03-01), None
Chem. Abst. 116:130582.

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