Blank and process for the formation of beam leads for IC chip bo

Details Blank and process for the formation of beam leads for IC chip bo Blank and process for the formation of beam leads for IC chip bo

1980-08-19

1982-08-03

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

H01R 4300

Patent

active

043421512

ABSTRACT:
A process is disclosed for the formation of frames of metal beam leads that are bonded to integrated circuit chips. The blank incorporates an improved negative-working resist having adhesion to the metal as well as flexibility. The process of forming the leads includes the step of fully photopolymerizing the resist to avoid outgassing of residual monomer as would otherwise occur during bonding.

REFERENCES:
patent: 3469982 (1969-09-01), Celeste
patent: 3763404 (1973-10-01), Aird
patent: 3795043 (1974-03-01), Forlani
patent: 3804631 (1974-04-01), Faust
patent: 4089733 (1978-05-01), Zimmerman

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