Heat exchange – Heat transmitter
Reexamination Certificate
2002-03-19
2004-02-24
Leo, Leonard R (Department: 3753)
Heat exchange
Heat transmitter
C165S080300, C165S122000, C174S016300, C257S722000, C361S697000, C361S704000
Reexamination Certificate
active
06695045
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates in general to an effective, quiet and thin bladed heat sink.
2. Description of the Related Art
Due to ever-increasing workloads placed on modern-day computers, combined with higher operating speeds, heat generated by central processing units (CPUs) in computers often reaches extreme levels. As well, the ventilation of the inside of computers is poor so that environmental temperatures of CPUs in operation run high. To avoid failure of CPUs due to overheating, a variety of heat sinks for cooling CPUs have been developed.
Referring to
FIG. 1
, reference numerals
10
and
30
represent a fan and a central processing unit (CPU), respectively. A conventional heat sink
20
generally is made of metal of good thermal conductivity, and has a base plate
22
and a plurality of fins
21
extending upward from the base plate
22
. Referring to
FIG. 2
, the base plate
22
of the heat sink
20
is fixed to the central processing unit
30
, while the fan
10
is supported by the fins
21
of the heat sink
20
. The central processing unit
30
in operation generates heat, the heat is transmitted to the heat sink
20
contacting the CPU
30
, and the fan
10
generates airflow on the heat sink
20
to dissipate heat. By the arrangement, the central processing unit
30
is cooled.
A conventional heat sink has the following flaws: (1) The airflow is obstructed by the base plate
22
of heat sink
20
and therefore circulates, reducing the efficiency of heat dissipation. (2) So-called “aerodynamic noise” is increased due to the circulation of hot air. (3) The heat sink
20
is very “thick” because of a vertical extension of the fins
21
, disadvantageous to mounting the heat sink in a portable computer.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a heat sink that dissipates heat very well.
Another object of the present invention is to provide a heat sink that produces minimum aerodynamic noise.
Another object of the present invention is to provide a heat sink suitable for a portable computer.
The heat sink of the present invention includes a connecting board, a plurality of blades, a frame and at least one reinforcing rib. The connecting board is enclosed by the frame. The blades radiate from the connecting board to the frame. Furthermore, the blades are disposed in layers and spaced apart, thereby allowing airflow to pass between the blades. Furthermore, the blades are reinforced by the reinforcing rib.
In operation, a fan blows on the heat sink of the present invention. The airflow rapidly passes through the spaced-apart blades of the heat sink to dissipate heat therefrom. Therefore, the airflow does not circulate, thereby promoting the efficiency of heat dissipation. The arrangement of the blades prevents circulation of hot air and thus minimizes aerodynamic noise. Furthermore, the heat sink of the present invention is thinner because of a horizontal extension of the blades, advantageous to mounting the heat sink in a portable computer.
REFERENCES:
patent: 3240263 (1966-03-01), Stewart
patent: 4611238 (1986-09-01), Lewis et al.
patent: 5229914 (1993-07-01), Bailey
patent: 5299090 (1994-03-01), Brady et al.
patent: 5583746 (1996-12-01), Wang
patent: 6196298 (2001-03-01), Shaw
patent: 6360816 (2002-03-01), Wagner
patent: 3151838 (1983-07-01), None
patent: 246432 (1987-11-01), None
Leo Leonard R
Merchant & Gould P.C.
Mitac Technology Corporation
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