Black composite particles for semiconductor sealing...

Details Black composite particles for semiconductor sealing... Black composite particles for semiconductor sealing...

2006-04-11

2006-04-11

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

C252S508000, C106S472000, C106S475000, C428S403000

Reexamination Certificate

active

07025905

ABSTRACT:
Black composite particles for a semiconductor sealing material of the present invention, comprises:an extender pigment as a core particle; anda black pigment formed on surface of the extender pigment in an amount of from 1 to 100 parts by weight based on 100 parts by weight of the extender pigment, and a semiconductor sealing material by using the black composite particles. Such black composite particles are not only enhanced in blackness, moisture resistance, fluidity and tinting strength, but also show an excellent dispersibility in binder resins, and the semiconductor sealing material is capable of exhibiting a high volume resistivity as well as excellent blackness, moisture resistance, soldering heat resistance, flowability and flexural strength.

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patent: 6800684 (2004-10-01), Hayashi et al.
patent: 6838218 (2005-01-01), Hayashi et al.
patent: 1 262 528 (2002-12-01), None
patent: 06 210631 (1994-11-01), None
Kirk-Othmer Encyclopedia of Chemical Technology, 1985, p. 888.

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