Bismaleimide resin composition containing epoxy resin and a phen

Details Bismaleimide resin composition containing epoxy resin and a phen Bismaleimide resin composition containing epoxy resin and a phen

1988-03-15

1989-03-28

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525502, 528104, 528117, C08G 5958, C08G 5940

Patent

active

048165310

ABSTRACT:
A curable composition is provided comprising a bismaleimide resin, an epoxy resin, and a phenolic resin curing agent. The composition can also contain an accelerator for enhanced low-temperature cure. The composition is useful for high-performance applications such as electrical lamination and filament-wound parts.

REFERENCES:
patent: 4128598 (1978-12-01), Makino
patent: 4296219 (1981-10-01), Takahashi
patent: 4510272 (1985-05-01), Loszewski

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