Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of...
Reexamination Certificate
2007-02-22
2009-11-03
Smith, Bradley K (Department: 2894)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
C438S343000, C438S353000, C438S354000
Reexamination Certificate
active
07611953
ABSTRACT:
A bipolar transistor has a collector that is contacted directly beneath a base-collector junction by metallization to reduce collector resistance. A conventional reach-through and buried layer, as well as their associated resistance, are eliminated. The transistor is well isolated, nearly eliminating well-to-substrate capacitance and device-to-device leakage current. The structure provides for improved electrical performance, including improved fT, Fmax and drive current.
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Ahlgren David C.
Freeman Gregory G.
Pagette Francois
Schnabel Christopher M.
Topol Anna W.
Abate Joseph P.
Belousov Alexander
Greenblum & Bernstein P.L.C.
International Business Machines - Corporation
Smith Bradley K
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