Bipolar transistor having high emitter efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Bipolar transistor structure – With specified electrode means

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257 77, 257587, 257591, H01L 310312, H01L 2358, H01L 27082

Patent

active

061147451

ABSTRACT:
A vertical conduction NPN bipolar transistor with a tunneling barrier of silicon carbide in the emitter providing a high emitter injection efficiency and high, stable current gain. The emitter structure comprises a heavily doped polysilicon layer atop a silicon carbide layer that contacts a shallow, heavily doped emitter region at the surface of an epitaxial silicon layer, which is disposed on a monocrystallinie silicon substrate. The silicon carbide layer is about 100 to 200 angstroms thick and has a composition selected to provide an energy band gap in the 1.8 to 3.5 eV range. The thickness and composition of the silicon carbide can be varied within the preferred ranges to tune the transistor's electrical characteristics and simplify the fabrication process.

REFERENCES:
patent: 5708281 (1998-01-01), Morishita
patent: 5739062 (1998-04-01), Yoshida et al.
patent: 6049098 (2000-04-01), Sato

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