Bipolar transistor and back-gated transistor structure and...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Forming inverted transistor structure

Reexamination Certificate

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C438S202000, C438S311000, C438S315000, C438S355000

Reexamination Certificate

active

07939417

ABSTRACT:
A structure is disclosed including a substrate including an insulator layer on a bulk layer, and a bipolar transistor in a first region of the substrate, the bipolar transistor including at least a portion of an emitter region in the insulator layer. Another disclosed structure includes an inverted bipolar transistor in a first region of a substrate including an insulator layer on a bulk layer, the inverted bipolar transistor including an emitter region, and a back-gated transistor in a second region of the substrate, wherein a back-gate conductor of the back-gated transistor and at least a portion of the emitter region are in the same layer of material. A method of forming the structures including a bipolar transistor and back-gated transistor together is also disclosed.

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