Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Reexamination Certificate
2005-03-08
2008-12-30
Sellers, Robert (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
C257S793000
Reexamination Certificate
active
07470754
ABSTRACT:
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent soldering heat resistance and a higher productivity, as well as a semiconductor device manufactured by encapsulating therewith. This invention relates to a epoxy resin composition for encapsulating a semiconductor comprising, as essential components, (A) an epoxy resin having a particular structure and (B) a phenolic resin comprising a phenolic resin component having a particular structure as a main component, which contains a component having up to three aromatic rings in one molecule in 0.8% or less in an area ratio as determined by GPC analysis, as well as a semiconductor device manufactured by encapsulating a semiconductor chip with the composition.
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Derwent accession No. 2000-227357 for Japanese Patent No. 2000-34393 and U.S. Patent No. 6,297,306, Osada et al., Feb. 2, 2000, one page.
Kuroda Hirofumi
Nikaido Hiroki
Sellers Robert
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Co. Ltd.
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