Bipartite heat sink positioning device for computer chips

Heat exchange – With retainer for removable article – Electrical component

Patent

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Details

165121, 165185, 257718, 257722, 361695, 361697, F28F 700

Patent

active

053680944

ABSTRACT:
A bipartite heat sink positioning device for computer chips incorporates a two-piece heat sink including a plurality of fins projecting from upper surfaces thereof and generally flat bottom surfaces adapted to engage a computer chip. Each of the sink bodies include inner and outer end portions with the inner end portions terminating in respective upstanding walls and the outer end portions being formed with respective elastic clamping parts. The outer end portions are also each formed with a pair of spaced fixing holes. The heat sink is adapted to be secured to a computer chip by positioning the first and second sink bodies upon the chip with the elastic clamping pans engaging respective opposing side shoulders of the chip and the inner end portions of the sink bodies being slightly spaced. The bipartite heat sink positioning device further includes a fan including a body provided with four tap holes positioned in spaced intervals about an outer peripheral portion of the body of the fan. The fan is adapted to be mounted upon the heat sink by means of a plurality of fasteners adapted to extend through the tap holes of the fan and to be secured within the fixing holes of the heat sink. According to a first embodiment, securing the fasteners causes the inner end portions of the sink bodies to come together thereby causing the clamping pans to firmly grasp the chip. In a second embodiment, a spring is used to bias the sink bodies together.

REFERENCES:
patent: 5251101 (1993-10-01), Liu

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