Biosensor

Electric heating – Metal heating – By arc

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S272800

Reexamination Certificate

active

06911621

ABSTRACT:
A method of forming a biosensor is provided. The method includes providing a substrate and a cover including first and second surfaces, positioning a reagent on the substrate, carving a channel by laser ablation in the first surface, and coupling the first surface of the cover to the second surface. The channel includes a first portion having a first height and a second portion having a second height that is less than the first height.

REFERENCES:
patent: 4081653 (1978-03-01), Koo et al.
patent: 4131484 (1978-12-01), Caruso et al.
patent: 4294679 (1981-10-01), Maurer et al.
patent: 4414059 (1983-11-01), Blum et al.
patent: 4684437 (1987-08-01), Donelon et al.
patent: 4865873 (1989-09-01), Cole et al.
patent: 4874500 (1989-10-01), Madou et al.
patent: 4897173 (1990-01-01), Nankai et al.
patent: 4902138 (1990-02-01), Goeldner et al.
patent: 4957582 (1990-09-01), Columbus
patent: 4963814 (1990-10-01), Parks et al.
patent: 4999582 (1991-03-01), Parks et al.
patent: 4999632 (1991-03-01), Parks
patent: 5018164 (1991-05-01), Brewer et al.
patent: 5089103 (1992-02-01), Swedberg
patent: 5104480 (1992-04-01), Wojnarowski et al.
patent: 5120420 (1992-06-01), Nankai et al.
patent: 5165407 (1992-11-01), Wilson et al.
patent: 5243516 (1993-09-01), White
patent: 5264103 (1993-11-01), Yoshioka et al.
patent: 5266179 (1993-11-01), Nankai et al.
patent: 5288636 (1994-02-01), Pollmann et al.
patent: 5334279 (1994-08-01), Gregoire
patent: 5336388 (1994-08-01), Leader et al.
patent: 5352351 (1994-10-01), White et al.
patent: 5366609 (1994-11-01), White et al.
patent: 5382346 (1995-01-01), Uenoyama et al.
patent: 5384028 (1995-01-01), Ito
patent: 5390412 (1995-02-01), Gregoire
patent: 5391250 (1995-02-01), Cheney, II et al.
patent: 5395504 (1995-03-01), Saurer et al.
patent: 5405511 (1995-04-01), White et al.
patent: 5413690 (1995-05-01), Kost et al.
patent: 5414224 (1995-05-01), Adasko et al.
patent: 5426850 (1995-06-01), Fukutomi et al.
patent: 5437999 (1995-08-01), Diebold et al.
patent: 5451722 (1995-09-01), Gregoire
patent: 5465480 (1995-11-01), Karl et al.
patent: 5496453 (1996-03-01), Uenoyama et al.
patent: 5508171 (1996-04-01), Walling et al.
patent: 5509410 (1996-04-01), Hill et al.
patent: 5512489 (1996-04-01), Girault et al.
patent: 5575930 (1996-11-01), Tietje-Girault et al.
patent: 5576073 (1996-11-01), Kickelhain
patent: 5589326 (1996-12-01), Deng et al.
patent: 5593739 (1997-01-01), Kickelhain
patent: 5628890 (1997-05-01), Carter et al.
patent: 5635054 (1997-06-01), Girault et al.
patent: 5682884 (1997-11-01), Hill et al.
patent: 5708247 (1998-01-01), McAleer et al.
patent: 5739039 (1998-04-01), Girault et al.
patent: 5755953 (1998-05-01), Henning et al.
patent: 5758398 (1998-06-01), Rijnbeek et al.
patent: 5759364 (1998-06-01), Charlton et al.
patent: 5762770 (1998-06-01), Pritchard et al.
patent: 5773319 (1998-06-01), Chu et al.
patent: 5798031 (1998-08-01), Charlton et al.
patent: 5948289 (1999-09-01), Noda et al.
patent: 5948695 (1999-09-01), Douglas et al.
patent: 5955179 (1999-09-01), Kickelhain et al.
patent: 5956572 (1999-09-01), Kidoguchi et al.
patent: 5965001 (1999-10-01), Chow et al.
patent: 6004441 (1999-12-01), Fujiwara et al.
patent: 6068748 (2000-05-01), Berger et al.
patent: 6103033 (2000-08-01), Say et al.
patent: 6134461 (2000-10-01), Say et al.
patent: 6165594 (2000-12-01), Moh et al.
patent: 6175752 (2001-01-01), Say et al.
patent: 6203952 (2001-03-01), O'Brien et al.
patent: 6258229 (2001-07-01), Winarta et al.
patent: 6287451 (2001-09-01), Winarta et al.
patent: 6299757 (2001-10-01), Feldman et al.
patent: 6309526 (2001-10-01), Fujiwara et al.
patent: 6338790 (2002-01-01), Feldman et al.
patent: 6399258 (2002-06-01), O'Brien et al.
patent: 6662439 (2003-12-01), Bhullar
patent: 6696008 (2004-02-01), Bradinger
patent: 2001/0006766 (2001-07-01), O'Brien et al.
patent: 2003/0088166 (2003-05-01), Say et al.
patent: 42 33 178 (1994-04-01), None
patent: 0 376 721 (1990-07-01), None
patent: 0 480 703 (1992-04-01), None
patent: 0 480 703 (1997-03-01), None
patent: 0 875 754 (1998-11-01), None
patent: 0 964 059 (1999-12-01), None
patent: 1 152 239 (2000-11-01), None
patent: 1 098 000 (2001-05-01), None
patent: 1 195 441 (2002-04-01), None
patent: 1 202 060 (2002-05-01), None
patent: 1 203 956 (2002-05-01), None
patent: 1 203 956 (2002-05-01), None
patent: 1 288 654 (2003-03-01), None
patent: 56100451 (1981-08-01), None
patent: 5-31 5703 (1993-11-01), None
patent: 7-66499 (1995-03-01), None
patent: 7-290751 (1995-11-01), None
patent: 9-260697 (1997-10-01), None
patent: 10-52780 (1998-02-01), None
patent: 10-241992 (1998-09-01), None
patent: 10-275959 (1998-10-01), None
patent: 10-303444 (1998-11-01), None
patent: 11-088784 (1999-03-01), None
patent: 11297890 (1999-10-01), None
patent: 2000-121594 (2000-04-01), None
patent: WO 91/02391 (1991-02-01), None
patent: WO 91/08474 (1991-06-01), None
patent: WO 95/22881 (1995-08-01), None
patent: WO 98/35225 (1998-08-01), None
patent: WO 98/49773 (1998-12-01), None
patent: WO 98/55856 (1998-12-01), None
patent: WO 99/13101 (1999-03-01), None
patent: WO 99/30152 (1999-06-01), None
patent: WO 99/45387 (1999-09-01), None
patent: WO 00/42472 (2000-07-01), None
patent: WO 00/73778 (2000-12-01), None
patent: WO 00/73785 (2000-12-01), None
patent: WO 01/25775 (2001-04-01), None
patent: WO 01/36953 (2001-05-01), None
patent: WO 01/75438 (2001-10-01), None
patent: WO 01/92884 (2001-12-01), None
patent: WO 02/27074 (2002-04-01), None
patent: WO 02/086483 (2002-10-01), None
Tender, L. et al., Electrochemical Patterning of Self-Assembled Monolayers onto Microscopic Arrays of Gold Electrodes Fabricated by Laser Ablation,Langmuir, 1996, 12, 5515-5518.
Tahhan, Isam, “Biocompatible Microstructuring of Polymers and Electrodes with an Excimer Laser”, MEDICS Workshop 2000 Speakers Abstracts, 2 pp.
Sheppard, Jr. et al. “Electrical Conductivity Measurements Using Microfabricated Interdigitated Electrodes”,Anal. Chem., 1993, 65, 1199-1202.
Srinivasan R., et al. “Ultraviolet Laser Ablation of Organic Polymers”,Chem. Rev., 1989, 89, 1303-1316.
Zongyi, Q., et al. “Excimer Laser Patterning on Thin Polymer Surfaces for Electrochemical Gas Sensors”, Polymer Physics Laboratory, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, Changchun, Peop. Rep. China., Proceedings of the International Conference on Lasers (1999) 21st(Abstract) 1pp.
Vaucher et al. “Laser Direct Imaging and Structuring: An Update”, http://www.circuitree.com/CDA/ArticleInformation/features/BNP_Features_Item/0.2133.81173.00.html; posted on: Aug. 1, 2002.
Wu, J. et al. “Single-shot Excimer Laser Ablation of Thick Polymer Resists on Metallic Substrates”, AMP Journal of Technology vol. 1 Nov., 1991, 69-79.
Srinivasan, R., “Ablation of Polymers and Biological Tisssue by Ultraviolet Lasers”, Science, vol. 234, Oct. 21, 1986, 559-564.
Colon, W., “Microanalysis: Biosensors at the Point of Care”, MST News 01/04, pp. 9-11.
Duley, W.W. “UV Lasers: effects and applications in materials science”, Chapter 3 Photochemical and photothermal effects, Cambridge University Press, pp. 78-97.
LPKF MicrolineLaser II, LPKF Laser & Electronics AG; LPKF; Art.-Nr. 107645-2 (01/00) (2pp.).
Microline Solutions, LPKF Laser & Electronics AG; LPKF; Art.-Nr. 107658-1 (01/00) (3pp.).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Biosensor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Biosensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Biosensor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3484016

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.