Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-10-26
2010-12-07
Nguyen, Khanh (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
Reexamination Certificate
active
07846285
ABSTRACT:
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
REFERENCES:
patent: 3699970 (1972-10-01), Brindley et al.
patent: 4573481 (1986-03-01), Bullara
patent: 4591415 (1986-05-01), Whitlaw
patent: 4837049 (1989-06-01), Byers et al.
patent: 5006286 (1991-04-01), Dery et al.
patent: 5109844 (1992-05-01), de Juan, Jr. et al.
patent: 5215088 (1993-06-01), Normann et al.
patent: 5468936 (1995-11-01), Deevi et al.
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5935155 (1999-08-01), Humayun et al.
patent: 6361716 (2002-03-01), Kleyer et al.
patent: 6400989 (2002-06-01), Eckmiller
patent: 6458157 (2002-10-01), Suaning
patent: 6975037 (2005-12-01), Farnworth et al.
patent: 7142909 (2006-11-01), Greenberg et al.
patent: 7211103 (2007-05-01), Greenberg et al.
patent: 7411303 (2008-08-01), Abbott
patent: 2003/0233134 (2003-12-01), Greenberg et al.
patent: 2008/0302468 (2008-12-01), Sidhu
Hansjoerg Beutel, et al.; Versatile ‘Microflex’-Based Interconnection Technique; SPIE Conf. on Smart Electronics and MEMS; Mar. 1998; pp. 174-182; vol. 3328; San Diego, CA.
L. Del Castillo, et al.; Flip Chip Packaging of a MEMS Neuro-Prosthetic System; IMAPS Int. Conf. & Exh. on Advanced Packaging and Systems; Mar. 2002; pp. 158-163; Reno, NV.
Marcel Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions; National Association of Corrosion Engineers; 1974; 9 pages; Houston, Tx.
Greenberg Robert J.
Little James Singleton
Zhou Dao Min
Dunbar Scott B.
Lendvai Tomas
Nguyen Khanh
Patel Vishal I
Schnittgrund Gary
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