Surgery: light – thermal – and electrical application – Light – thermal – and electrical application
Reexamination Certificate
2007-05-01
2007-05-01
Getzow, Scott M. (Department: 3762)
Surgery: light, thermal, and electrical application
Light, thermal, and electrical application
Reexamination Certificate
active
10174349
ABSTRACT:
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by one of several methods, including attachment by an electrically conductive adhesive, such as epoxy or polyimide, containing platinum metal flake in biocompatible glue; diffusion bonding of platinum bumps covered by an insulating layer; thermal welding of wire staples; or an integrated interconnect fabrication. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
REFERENCES:
patent: 3699970 (1972-10-01), Brindley
patent: 4573481 (1986-03-01), Bullara
patent: 4837049 (1989-06-01), Byers
patent: 5006286 (1991-04-01), Dery et al.
patent: 5109844 (1992-05-01), de Juan
patent: 5215088 (1993-06-01), Normann
patent: 5468936 (1995-11-01), Deevi et al.
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5935155 (1999-08-01), Humayun
patent: 6361716 (2002-03-01), Kleyer et al.
Hansjoerg Beutel, Thomas Stieglitz, Joerg Uwe Meyer, “Versatile ‘Microflex’-Based Interconnection Technique,” Proc. SPIE Conf on Smart Electronics and MEMS, San Diego, Cal., Mar. 1998, vol. 3328, pp. 174-182.
L. Del Castillo, R. Graber, S. D'Agostino, M. Mojarradi and A. Mottiwala, “Flip Chip Packaging of a MEMS Neuro-Prosthetic System,” Proc. IMAPS International Conference & Exhibition on Advanced Packaging and Systems, Reno, Nevada, Mar. 2002, pp. 158-163.
M. Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, National Assocation of Corrosion Engineers, Houston, 1974, pp. 399-405.
Joseph V. Mantese and William V. Alcini, “Platinum Wire Wedge Bonding: A New IC and Microsensor Interconnect,” J. Electornic Materials, 17 (4) 1988, pp. 285-289.
Andreas Schneider, Thomas Stieglitz, Werner Haberer, Hansjorg Beutel, and J-Uwe Meyer, Flexible Interconnects for Biomedical Microsystems Assembly, IMAPS Conference, Jan. 31, 2002.
Greenberg Robert J.
Mann Alfred E.
Ok Jerry
Talbot Neil
Dunbar Scott B.
Getzow Scott M.
Lendvai Tomas
Schnittgrund Gary
Second Sight Medical Products, Inc.
LandOfFree
Biocompatible bonding method and electronics package... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Biocompatible bonding method and electronics package..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Biocompatible bonding method and electronics package... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3785753