Wireworking – Applying wire – Binder tightening and joining implements
Reexamination Certificate
2005-08-09
2005-08-09
Banks, Derris H. (Department: 3725)
Wireworking
Applying wire
Binder tightening and joining implements
C140S123600, C100S029000
Reexamination Certificate
active
06926045
ABSTRACT:
In order to prevent an uncut part from being formed in a band portion protruding from a head portion of a binding band, the binding device of the invention has a tightening function of tightening bound articles around which the binding band is wound, and a cutting away function of, after the bound articles are tightened, cutting away an extra part of the band portion.
REFERENCES:
patent: 3712346 (1973-01-01), Noorily
patent: 3746055 (1973-07-01), Farkas et al.
patent: 5127446 (1992-07-01), Marelin
patent: 5832964 (1998-11-01), Joshi
patent: 6206053 (2001-03-01), Hillegonds
Miyazaki Tadahiro
Ogawa Kiyoshi
Bacon & Thomas
Banks Derris H.
Nguyen Jimmy
Tyton Company of Japan, Ltd.
LandOfFree
Binding device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Binding device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Binding device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3460553