Binder system and method for particulate material...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

Reexamination Certificate

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Details

C524S284000, C524S285000, C524S290000, C524S394000, C524S430000, C524S439000, C524S442000

Reexamination Certificate

active

06846862

ABSTRACT:
The present invention relates to a binder composition comprising an aliphatic polyester polymer: an ethylenebisamide wax; and a guanidine wetting agent. The composition may also contain an additive which accelerates or extends debinding of the binder composition, and to a method for forming a sintered part by powder injection molding, including the steps of forming a green composition comprising a binder and an inorganic powder, wherein the binder is a composition comprising an aliphatic polyester polymer, an ethylenebisamide wax, and a guanidine wetting agent, and may further include an additive which accelerates or delays completion of debinding of the binder; melting the composition; injecting the composition into a mold for a part; heating the part to a temperature at which the binder decomposes; heating the part to a temperature at which the inorganic powder is sintered.

REFERENCES:
patent: 3933941 (1976-01-01), Yonemitsu et al.
patent: 4197118 (1980-04-01), Wiech, Jr.
patent: 4265794 (1981-05-01), Pett et al.
patent: 4283360 (1981-08-01), Henmi et al.
patent: 4305756 (1981-12-01), Wiech, Jr.
patent: 4456713 (1984-06-01), French et al.
patent: 4595558 (1986-06-01), Baldwin et al.
patent: 4602953 (1986-07-01), Wiech, Jr.
patent: 4624812 (1986-11-01), Farrow et al.
patent: 4638029 (1987-01-01), Meschke et al.
patent: 4734237 (1988-03-01), Fanelli et al.
patent: 4765950 (1988-08-01), Johnson
patent: 4814370 (1989-03-01), Kramer et al.
patent: 4891399 (1990-01-01), Ohkawa et al.
patent: 4898902 (1990-02-01), Nagai et al.
patent: 5002988 (1991-03-01), Ono et al.
patent: 5028367 (1991-07-01), Wei et al.
patent: 5030677 (1991-07-01), Achikita et al.
patent: 5066625 (1991-11-01), Philipp
patent: 5087594 (1992-02-01), Kato et al.
patent: 5098942 (1992-03-01), Menke et al.
patent: 5135977 (1992-08-01), Achikita et al.
patent: 5145900 (1992-09-01), Sterzel et al.
patent: 5155158 (1992-10-01), Kim
patent: 5250251 (1993-10-01), Fanelli et al.
patent: 5252314 (1993-10-01), DeGuire et al.
patent: 5254613 (1993-10-01), Bayer et al.
patent: 5256451 (1993-10-01), Philipp et al.
patent: 5266264 (1993-11-01), Miura et al.
patent: 5278251 (1994-01-01), Ohtani et al.
patent: 5280086 (1994-01-01), Kawamoto et al.
patent: 5281650 (1994-01-01), Burk et al.
patent: 5286802 (1994-02-01), Uesugi et al.
patent: 5298654 (1994-03-01), DeGuire et al.
patent: 5332537 (1994-07-01), Hens et al.
patent: 5342563 (1994-08-01), Quinn et al.
patent: 5362791 (1994-11-01), Ebenhoech et al.
patent: 5366669 (1994-11-01), Quadir et al.
patent: 5380179 (1995-01-01), Nishimura et al.
patent: 5395654 (1995-03-01), Philipp et al.
patent: 5397531 (1995-03-01), Peiris et al.
patent: 5417756 (1995-05-01), Bayer et al.
patent: 5421853 (1995-06-01), Chen et al.
patent: 5439964 (1995-08-01), Ohst et al.
patent: 5441695 (1995-08-01), Gladden
patent: 5585428 (1996-12-01), Quinn et al.
patent: 5641920 (1997-06-01), Hens et al.
patent: 5744532 (1998-04-01), Kankawa et al.
patent: 5977230 (1999-11-01), Yang et al.
patent: 6093761 (2000-07-01), Schofalvi
patent: 6204316 (2001-03-01), Schofalvi

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