Binder resin for resin transfer molding preforms, preforms made

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264135, 264137, 264258, 264324, 26433112, 428 74, 428114, 428224, 428236, 428237, 428239, 428240, 428245, 428246, 428260, 428261, 428262, 428268, 428281, 428282, 428283, 428284, 428286, 428290, 428327, 428339, 428413, B29C 4320, B29C 4120, D04H 158, D04H 160

Patent

active

054320100

ABSTRACT:
The invention relates to a resin transfer molding preform binder resin that comprises at least one aromatic polyepoxide, a fluorene epoxide that is different than the aromatic polyepoxide and having a defined structure, and a 9,9-bis(aminophenyl)fluorene curing agent. The binder resin is a solid, room temperature stable, essentially nonsintering powder that displays a glass transition temperature greater than about 40.degree. C. Also disclosed are preforms made with the binder resin and a method for preparing the preforms.

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Advances in Binders for RTM and SRIM Fiber Preforming, Advanced Composite Materials: New Developments and Applications Conference Proceedings, Detroit, Mich. USA, Sep. 30-Oct. 3, 1991 pp. 41-47.
Low Flammability Epoxy Polymers Via 9,9-BIS(4,4'-Aminophenyl)Fluorene, A project Presented to the Department of Chemistry San Jose University, Jeffrey G. Holloway, Aug. 1984.
PR 500 Epoxy Resin, Issue No. 2, Apr. 1, 1990.
SP 500-2 Carbon Epoxy Prepreg, Issue No. 3, Jun. 1, 1990.

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