Binder removal from thermoplastically formed SiC article

Plastic and nonmetallic article shaping or treating: processes – Including step of generating heat by friction

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

501 88, 501 90, 264 65, C04B 3536, C04B 3564

Patent

active

045308080

ABSTRACT:
A sintered SiC body is produced by forming a thermoplastically moldable ceramic composition comprised of sinterable silicon carbide powder and binder, thermoplastically molding the ceramic composition into a body, embedding the body in nominally spherical particles having a density greater than 80% of the particle's theoretical density and being selected from the group consisting of polycrystalline silicon carbide, free carbon-coated polycrystalline silicon carbide, free carbon and mixtures thereof, baking the embedded body to remove the binder therefrom, recovering and sintering said baked body.

REFERENCES:
patent: 3351688 (1967-11-01), Kingery et al.
patent: 3882210 (1975-05-01), Alexander et al.
patent: 4004934 (1977-01-01), Prochazka
patent: 4041117 (1977-08-01), Prochazka
patent: 4144207 (1979-03-01), Ohnsorg
patent: 4207226 (1980-06-01), Storm
patent: 4233256 (1980-11-01), Ohnsorg
patent: 4312954 (1982-01-01), Coppola et al.
patent: 4424179 (1984-01-01), Minjolle et al.
"Rate-Controlled Extraction Unit for Removal of Organic Binders from Injection-Moulded Ceramics", Johnson et al., the Swedish Institute for Silicate Research (before 1984).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Binder removal from thermoplastically formed SiC article does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Binder removal from thermoplastically formed SiC article, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Binder removal from thermoplastically formed SiC article will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-634016

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.