Bimetallic junctions

Metal fusion bonding – Process – Plural joints

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228194, 228232, B23K 1500, B23K 1900

Patent

active

040335046

ABSTRACT:
The formation of voids through interdiffusion in bimetallic welded structures exposed to high operating temperatures is inhibited by utilizing an alloy of the parent materials in the junction of the parent materials or by preannealing the junction at an ultrahigh temperature. These methods are also used to reduce the concentration gradient of a hardening agent.

REFERENCES:
patent: 3105292 (1963-10-01), Jeune
patent: 3560700 (1971-02-01), Staffort et al.
patent: 3646591 (1972-02-01), Thomas et al.
patent: 3680197 (1972-08-01), Blum et al.
patent: 3696499 (1972-10-01), Dromsky
patent: 3714702 (1973-02-01), Hammond
patent: 3740828 (1973-06-01), Buchinski et al.
patent: 3794807 (1974-02-01), Bailey et al.

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