Bimetallic insert fin for high conduction cooling structure

Details Bimetallic insert fin for high conduction cooling structure Bimetallic insert fin for high conduction cooling structure

1991-07-01

1992-07-21

Ford, John K.

Heat exchange

Movable heating or cooling surface

Rotary drum

165 804, 165 96, 165 803, 361385, 361384, 357 82, F28F 2700, F28F 1300

Patent

active

051314568

ABSTRACT:
A high conduction cooling structure useful for dissipating heat from integrated circuit devices includes a cooling base (10), a bulk heat transfer element (18), adjacent spaced apart cooling fins (14 and 16), and a bimetallic strip (22). The cooling base (10) is positioned in heat transfer relationship with an integrated circuit device and as it increases in temperature, the bimetallic strip (22) flexes outwardly and contacts the cooling fins (14 and 16). The contact created with the cooling fins (14 and 16) allows for more efficient transfer of thermal energy.

REFERENCES:
patent: 2782782 (1957-02-01), Taylor
patent: 2902266 (1959-09-01), Isham
patent: 2949283 (1960-08-01), Smith
patent: 3225820 (1965-12-01), Riordan
patent: 3438430 (1969-04-01), Kestemont
patent: 3489203 (1970-01-01), Fischell
patent: 3823772 (1974-07-01), Lavering et al.
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4263965 (1981-04-01), Mansuria et al.
patent: 4381032 (1983-04-01), Cutchaw
patent: 4483389 (1984-11-01), Balderes et al.
patent: 4535841 (1985-08-01), Kok
patent: 4685211 (1987-08-01), Hagihara et al.
patent: 4709754 (1987-12-01), Chu et al.
patent: 4765400 (1988-08-01), Chu et al.
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4800956 (1989-01-01), Hamburgen
R. C. Chu & R. E. Simms "A Bimetallic Retention Device" IBM Technical Disclosure Bulletin vol.20, No. 2, Jul. 1977 p. 675.

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