Bidirectional singulation saw and method

Details Bidirectional singulation saw and method Bidirectional singulation saw and method

2007-09-11

2007-09-11

Ashley, Boyer D. (Department: 3724)

Cutting

Tool engages work during dwell of intermittent workfeed

With means to guide, position, or present work to work-feed...

C083S280000, C083S039000, C083S073000, C083S576000, C083S485000, C083S614000, C083S884000, C125S013010, C125S020000, C125S023010

Reexamination Certificate

active

09849049

ABSTRACT:
A singulation saw for sawing either substrate or wafers includes a pair of counter-rotating saw blades mounted for independent movement in a vertical direction for alternatively engaging with a substrate to be singulated. The singulation saw further includes a transport system including a pair of substrate carriers reciprocates the substrates. While the first substrate is being cut, the second substrate or other substrate carrier sequentially unloads a cut substrate, loads a new uncut substrate and then moves the uncut substrate to a vision system for determining the position of the substrate relative to the second carrier and then positions the second carrier and its substrate in a standby position ready to be cut by the pair of saw blades that are cutting the first substrate. As the first cut substrate is moved to an unload position, the new uncut substrate is moved into a cutting position.

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