Biaxially oriented polyamide film having surface protrusions

Details Biaxially oriented polyamide film having surface protrusions Biaxially oriented polyamide film having surface protrusions

1995-12-22

1998-02-17

Watkins, William

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

428149, 428323, 428331, 4284744, 4284755, 4284761, 4284769, 428910, B32B 516, B32B 2734

Patent

active

057189650

ABSTRACT:
A biaxially oriented polyamide resin film superior in slip characteristics and transparency, which comprises a polyamide resin containing surface-forming fine particles in a proportion of 0.03-0.80% by weight of the film, the film surface having protrusions formed by the fine particles contained in a proportion of 200-1,000 protrusions/mm.sup.2, and the area proportion of voids formed on the film surface being not more than 0.1%. The present invention provides a biaxially oriented polyamide resin film strong and superior in resistance to pinhole, laminating property and appearance, which is free of curling or peeling of laminated films (delamination) when subjected to boiling water treatment and which has superior properties as a packing material, particularly, a packing bag for retort-packed food.

REFERENCES:
patent: 3995084 (1976-11-01), Berger et al.
patent: 4693932 (1987-09-01), Koze et al.
patent: 4818581 (1989-04-01), Katoh et al.
patent: 4952449 (1990-08-01), Okazaki et al.
patent: 5051292 (1991-09-01), Katoh et al.

Affiliated with

Also associated with

Rating

Biaxially oriented polyamide film having surface protrusions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Biaxially oriented polyamide film having surface protrusions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Biaxially oriented polyamide film having surface protrusions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1782715