Bi-planar multi-chip module

Details Bi-planar multi-chip module Bi-planar multi-chip module

1994-01-11

1995-12-19

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257700, 257723, 257778, H01L 2312, H01L 23488

Patent

active

054770823

ABSTRACT:
A bi-planar multi-chip package has die mounted on both sides of an insulating flexible carrier. The die are located in two parallel planes, with the flexible carrier located on a third plane between the two die planes. The die are mounted with the active circuit area facing each other on opposing sides of the flexible carrier. The carrier has conductive layers forming interconnect traces on both sides, and through-vias for connecting traces on opposite sides. The opposing die are mounted to the carrier with a solder-bump process with opposing pads located directly opposite each other. Vias are located in close proximity to the pads, between adjacent pads on the flexible carrier. Because the vias are between two adjacent pads, the interconnect length between two pads is on the order of the pad pitch. Thus opposing pads on the two die may be connected through the adjacent via with a small interconnect length.

REFERENCES:
patent: 4535219 (1985-08-01), Sliwa, Jr.
patent: 4740868 (1988-04-01), Hawkins
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 4943844 (1990-07-01), Oscilowski et al.
patent: 4949224 (1990-08-01), Yamamura et al.
patent: 5182632 (1993-01-01), Bechtel et al.
patent: 5205035 (1993-04-01), DiAngelo et al.
patent: 5208729 (1993-05-01), Cipolla et al.
patent: 5238176 (1993-08-01), Nishimura
patent: 5243141 (1993-09-01), Yonehara
patent: 5244833 (1993-09-01), Gansuage et al.
patent: 5252857 (1993-10-01), Kane et al.
patent: 5268815 (1993-12-01), Cipolla et al.
"Area Array TAB Package Technology", by Andros and Hammer, ITAP proceedings, 1993.
"Area Array TAB" brochure, IBM?, 1993?.

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