Bi-metallic electroforming technique

Details Bi-metallic electroforming technique Bi-metallic electroforming technique

1983-09-20

1985-04-16

Tufariello, Thomas

Chemistry: electrical and wave energy

Processes and products

204 9, C25D 100, C25D 102

Patent

active

045114382

ABSTRACT:
A method of forming articles on an electrically conductive mandrel, and the article produced, is disclosed. Initially, a first layer of metal is electroformed on the mandrel; then alternating electrolessly deposited metal layers of, e.g., two different metals are deposited on the electroformed first layer to form a bi-metallic laminated structure; and then a final layer of metal is electroformed on the laminated structure. The mandrel is then removed to form the article. This method provides a more uniform wall thickness of the final article, even when the mandrel has inner wall portions (e.g., grooves, slots, holes, etc.), as compared with articles formed by conventional electroforming techniques. This method can be used, among other uses, to form corrugated waveguide horns for extremely high frequency applications.

REFERENCES:
patent: 2592614 (1952-04-01), Stoddard, Jr.
patent: 2826524 (1958-03-01), Molloy
patent: 2898273 (1959-08-01), La Forge, Jr.
patent: 3341432 (1967-09-01), Kadner
patent: 3947348 (1976-03-01), Schabernack
patent: 4295142 (1981-10-01), Thiere
Rodgers, Handbook of Practical Electroplating, 1959, pp. 136-157.
Electroplating Engineering Handbook, 3rd Ed., Edited by A. K. Graham, 1971, p. 240.

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