Bi-level heat sink

Details Bi-level heat sink Bi-level heat sink

2005-11-22

2005-11-22

Leo, Leonard R. (Department: 3753)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C174S015200, C257S715000, C361S700000

Reexamination Certificate

active

06966361

ABSTRACT:
A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.

REFERENCES:
patent: 5560423 (1996-10-01), Larson et al.
patent: 5720339 (1998-02-01), Glass et al.
patent: 5819402 (1998-10-01), Edwards et al.
patent: 5845702 (1998-12-01), Dinh
patent: 5901781 (1999-05-01), Arai et al.
patent: 5921315 (1999-07-01), Dinh
patent: 5959837 (1999-09-01), Yu
patent: 6082443 (2000-07-01), Yamamoto et al.
patent: 6102110 (2000-08-01), Julien et al.
patent: 6163073 (2000-12-01), Patel
patent: 6167948 (2001-01-01), Thomas
patent: 6172872 (2001-01-01), Katsui
patent: 6189601 (2001-02-01), Goodman et al.
patent: 6250375 (2001-06-01), Lee et al.
patent: 6256201 (2001-07-01), Ikeda et al.
patent: 6263959 (2001-07-01), Ikeda et al.
patent: 6269866 (2001-08-01), Yamamoto et al.
patent: 6367541 (2002-04-01), McCullough
patent: 6424528 (2002-07-01), Chao
patent: 6538889 (2003-03-01), Barsun et al.
patent: 6626233 (2003-09-01), Connors
patent: 2-10800 (1990-01-01), None

Affiliated with

Also associated with

Rating

Bi-level heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bi-level heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bi-level heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3478101