Bi-directional cooling arrangement for use with an electronic co

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

361690, 361694, 361697, 361719, 361720, 361721, 174 161, 165 803, H05K 720

Patent

active

059402660

ABSTRACT:
A processor book includes a processor card having front and rear surfaces, and at least one high heat component attached to the front surface. Two separate flows of cooling gas are conveyed to the processor card from two separate directions. A cooling duct is provided adjacent to the front surface of the processor card, and conveys one of the flows of cooling gas. The cooling duct has an outlet in a region of the high heat component.

REFERENCES:
patent: 5063476 (1991-11-01), Hamadah et al.
patent: 5456632 (1995-10-01), Ohtsu et al.
patent: 5563768 (1996-10-01), Perdue
patent: 5566377 (1996-10-01), Lee
patent: 5751550 (1998-05-01), Korinsky

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bi-directional cooling arrangement for use with an electronic co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bi-directional cooling arrangement for use with an electronic co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bi-directional cooling arrangement for use with an electronic co will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-320794

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.