BGA socket terminal

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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Details

439 83, H01R 100

Patent

active

061322229

ABSTRACT:
A socket for providing electrical connection between an IC and a mother board comprises an insulative housing defining a number of terminal passageways and a number of terminals received in the passageways. Each terminal includes a contact portion, a securing portion, an adjustment portion and a soldering portion. The contact portion is adapted to engage a pin of the IC. The securing portion is interferentially fit in the passageway for retaining the terminal therein. The feature of the invention lies in the resilient adjustment portion which can be easily and resiliently deformed.

REFERENCES:
patent: 4341433 (1982-07-01), Cherian et al.
patent: 4637670 (1987-01-01), Collar et al.
patent: 4775333 (1988-10-01), Grider et al.
patent: 5201663 (1993-04-01), Kikuchi et al.
patent: 5746608 (1998-05-01), Taylor

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