BGA socket having extensible solder ball so as to compensate...

Details BGA socket having extensible solder ball so as to compensate... BGA socket having extensible solder ball so as to compensate...

2008-05-28

2009-11-24

Hyeon, Hae Moon (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

Distinct contact secured to panel circuit

C257S738000

Reexamination Certificate

active

07621762

ABSTRACT:
A solder ball is adapted for a ball grid array socket and comprises a core portion (1) and a layer (2) of solder alloy coated an outer surface of the core portion. The core portion is consisting of tin essentially, and the layer of solder alloy contains at least two metal materials.

REFERENCES:
patent: 5841198 (1998-11-01), Chia et al.
patent: 6002168 (1999-12-01), Bellaar et al.
patent: 6350669 (2002-02-01), Pu et al.
patent: 6507121 (2003-01-01), Huang
patent: 6610591 (2003-08-01), Jiang et al.
patent: 7265046 (2007-09-01), Kondo et al.
patent: 2007214172 (2007-08-01), None

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