BGA socket

Details BGA socket BGA socket

1999-10-19

2001-04-24

Paumen, Gary F. (Department: 2833)

Electrical connectors

With coupling movement-actuating means or retaining means in...

Including compound movement of coupling part

C439S083000

Reexamination Certificate

active

06220884

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a BGA socket, and especially to a BGA socket having a plurality of standoffs for stably spacing the BGA socket above a mother board and for eliminating wicking of molten solder.
A PGA (Pin Grid Array) socket is commonly used in a computer for providing electrical connection between an IC (Integral circuit) chip and a mother board for electrical connecting an IC chip to a mother board. The PGA socket is usually connected to corresponding pads on the mother board using Through Hole technology. A plurality of through holes is defined through the mother board for allowing corresponding tails of the socket to extend therethrough. However, the through holes occupy space on both sides of the mother board thereby hindering an efficient use thereof.
To absolve the above problem, a BGA (Ball Grid Array) socket is adopted for connection of the IC chip to the mother board. A plurality of solder balls is disposed between tails of the IC chip and electrical pads on the mother board. The solder balls are heated and become molten thereby electrically connecting the tails to the mother board after the molten solder solidifies. The pertinent prior art is disclosed in Taiwan Patent Application Nos. 86,105,336 and 86,100,612.
Referring to
FIGS. 1 and 2
, a conventional BGA socket
2
comprises an insulative cover
20
and a base
21
attached to a bottom surface of the cover
20
. The cover
20
defines a plurality of apertures (not shown) therein. The base
21
defines a plurality of passageways
22
corresponding to the apertures of the cover
20
for retaining corresponding terminals
24
therein. An IC chip (not shown) is attached to a top surface of the cover
20
. A plurality of pins of the IC chip extends through the apertures of the cover
20
into the passageways
22
of the base
21
for engaging with the terminals
24
. The terminals
24
are electrically connected to a mother board
3
by melting solder balls
210
disposed therebetween. However, the BGA socket
2
does not have a standoff for supporting the BGA socket
2
above the mother board
3
. Thus, the solder balls
210
directly sustain the entire weight of the BGA socket
2
. During the heating process, the solder balls
210
are unlikely to become synchronously molten whereby a height of the BGA socket
2
above the mother board
3
is difficult to control. Furthermore, a bottom surface of the base
21
may not be parallel to the mother board
3
due to the nonsynchronous melting process of the solder balls
210
. The molten solder may upwardly wick into the passageways
22
thereby adversely affecting performance of the terminals
24
. Thus, a BGA socket which can absolve the above problems is desired.
SUMMARY OF THE INVENTION
Accordingly, the primary object of the present invention is to provide a BGA socket having a plurality of standoffs thereby ensuring that the BGA socket is aligned in parallel with a mother board.
Another object of the present invention is to provide a BGA socket which is stably distanced a predetermined height above a mother board.
A further object of the present invention is to provide a BGA socket which prevents wicking of molten solder into passageways thereof.
To fulfill the above-mentioned objects, a BGA socket of the present invention comprises an insulative cover and a base. The base defines a plurality of passageways therein. A plurality of triangular plates projects from edges of the base. A barb is formed on an edge of each triangular plate. The cover defines a plurality of apertures therein in alignment with the passageways of the base. A plurality of terminals is received in the passageways. A plurality of elongate standoffs is formed on a bottom surface of the cover corresponding to the triangular plates of the base. An elongate slot is defined in an edge of each standoff. The barbs of the base are slidably received in the slots of the cover whereby the cover is slidable along the base in a determined direction. The standoffs of the cover extend beyond a bottom surface of the base. A solder ball is disposed between the base and a mother board, and aligned with each passageway and a corresponding electrical pad on the mother board. The solder balls are heated and become molten. A bottom face of each standoff abuts against a top surface of the mother board thereby stably distancing the BGA socket a predetermined height above the mother board whereby a bottom surface of the BGA is parallel to the top surface of the mother board.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 5658160 (1997-08-01), Lai
patent: 5730615 (1998-03-01), Lai et al.

Affiliated with

Also associated with

Rating

BGA socket does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with BGA socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and BGA socket will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2523292