BGA package semiconductor device and inspection method therefor

Details BGA package semiconductor device and inspection method therefor BGA package semiconductor device and inspection method therefor

1996-07-02

1999-11-16

Brock, Michael

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, G01R 3126, H01L 2358

Patent

active

059864605

ABSTRACT:
A semiconductor device includes a substrate, a semiconductor chip provided on the substrate, a plurality of terminals provided on a first side of the substrate, each electrically connected to the semiconductor chip and a plurality of test pads for performing electrical characteristic tests on the semiconductor chip, each test pad being electrically connected to a respective terminal in one-to-one correspondence.

REFERENCES:
patent: 5213676 (1993-05-01), Reele et al.
patent: 5288539 (1994-02-01), Araki
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5298464 (1994-03-01), Schlesinger et al.
patent: 5378981 (1995-01-01), Higgins, III
patent: 5447264 (1995-09-01), Koopman et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5554940 (1996-09-01), Hubacher
Rational for adopting BGA, Nikkei Electronics, Feb. 14, 1994, at 59-73 (Partial english translation provided herewith).
ASIC, Nikkei Electronics, Mar. 20, 1989, at 209-216 (Partial english translation provided herewith).

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