Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-10-01
1998-06-16
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439264, H01R 909
Patent
active
057660212
ABSTRACT:
A reusable socket adapted for use in making an electrical connection between an integrated circuit of a ball grid array (BGA) type package and a circuit board or test fixture. In one embodiment, the socket includes a return member for reshaping the socket. In a further embodiment, a socket assembly includes a plurality of spaced sockets. In an alternative embodiment, a socket assembly further includes a base member. In another embodiment, a socket is formed from a temperature dependent smart memory material. In a further embodiment, a socket assembly includes a plurality of sockets formed from a shape memory material. In an alternative embodiment, a zero insertion force (ZIF) or a low insertion force (LIF) socket assembly for a BGA package includes a plurality of sockets and a lever adapted for frictionally engaging respective BGA contact balls.
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Aries Electronics, Inc., "Ball Grid Array Evaluation Kit with 255 Position BallNest.TM.Socket", Rev A, data sheet, not dated, one sheet.
Aries Electronics, Inc., "BallNest.TM. BGA Socket with 16.times.16 Grid", Rev B, data sheet, not dated, one sheet.
Crotzer David R.
Pickles Charles S.
Abrams Neil
Augat Inc.
Patel T. C.
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