Beveled wafer for thermal gradient zone melting utilizing a beve

Details Beveled wafer for thermal gradient zone melting utilizing a beve Beveled wafer for thermal gradient zone melting utilizing a beve

1978-12-07

1979-10-09

Ozaki, G.

Metal treatment

Barrier layer stock material, p-n type

148 15, 252 623E, 252 623GA, 357 55, H01L 21225

Patent

active

041704967

ABSTRACT:
A body of semiconductor material to be processed by thermal gradient zone melting (TGZM) has an outer side peripheral surface beveled at a predetermined included angle .alpha. with the bottom surface of the body in order that the radiant heat impinging on the beveled side peripheral surface is equal to the radiant heat emitted by the beveled side peripheral surface of the body.

REFERENCES:
patent: 3179860 (1965-04-01), Clark et al.
patent: 3255055 (1966-06-01), Ross
patent: 3697829 (1972-10-01), Huth et al.
patent: 3895967 (1975-07-01), Anthony et al.
patent: 4001047 (1977-01-01), Boah
patent: 4035199 (1977-07-01), Anthony et al.
patent: 4075038 (1978-02-01), Anthony et al.

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