Beveled semiconductor silicon wafer and manufacturing method the

Details Beveled semiconductor silicon wafer and manufacturing method the Beveled semiconductor silicon wafer and manufacturing method the

1990-04-06

1991-06-04

James, Andrew J.

Fishing, trapping, and vermin destroying

437225, 437249, 148DIG161, H01L 2906, H01R 1302, H01R 1364

Patent

active

050218620

ABSTRACT:
A semiconductor silicon wafer usable for integrated circuits has beveled portions unsymmetrically formed along circumferential edges of front and back surfaces thereof. An angle between an inclining surface of the beveled portion and a main surface on the back surface side is larger than that between the inclining surface of the beveled portion and the main surface on the front surface side. Therefore the circumferential edges are prevented from being chipped.

REFERENCES:
patent: 4630093 (1986-12-01), Yamaguchi et al.
patent: 4783225 (1988-11-01), Maejima et al.

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