Beryllium-copper bonding material

Metal treatment – Process of modifying or maintaining internal physical... – Producing or treating layered – bonded – welded – or...

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148521, 148536, 228194, 428618, 428675, C21D 118, C22F 118

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058955330

ABSTRACT:
For bonding pure beryllium to a copper alloy, a beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

REFERENCES:
patent: 2534643 (1950-12-01), Warner
copper-beryllium alloys," Mod. Develop. Powder Met. (1973), vol. date 1974, 7, 505-17, (abstract only).
Eckman et al., "Diffusion bonding of beryllium-copper alloys," J. Mater. Sci. (1992), 27(1), 49-54, (abstract only).
"Proceedings of the 18th Symposium of Fusion Technology", Herschback et al., Fusion Technology 1994, Aug., 1994, vol. 1, pp. 431-434.
"Proceedings 2nd IEA International Workshop on Beryllium Technology for Fusion", Glen R. Longhurst, Sep., 1995, pp. 364-380.
"Beryllium-metals joints for application in the plasma-facing components", V.R. Barabash et al., Journal of Nuclear Materials 212-215 (1994) pp. 1604-1607.

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