Beryllium-copper bonding material

Details Beryllium-copper bonding material Beryllium-copper bonding material

1999-01-19

2000-06-20

Ip, Sikyin

Metal treatment

Stock

Copper base

420494, 419 6, C22C 900

Patent

active

060773650

ABSTRACT:
For bonding pure beryllium to a copper alloy, a functionally gradient beryllium-copper material comprising a single layer or multiple layers having a thickness of 0.3-3.0 mm and containing at least 50 atomic % of Cu is inserted between the pure beryllium and the copper alloy to prevent bonding strength from degrading in the bonding process or during operation of a nuclear fusion reactor, by effectively mitigating formation of brittle intermetallic compounds and generation of thermal stress at the bonding interface.

REFERENCES:
patent: 2534643 (1950-12-01), Warner
patent: 3378355 (1968-04-01), Larsen et al.
Herschback et al., "Proceedings of the 18th Symposium on Fusion Technology", Fusion Technology 1994, Aug. 1995, vol. 1, pp. 431-434.
Glen R. Longhurst, "Proceedings 2nd IEA International Workshop on Beryllium Technology for Fusion", Sep., 1995, pp. 364-380.
V.R. Barabash et al., "Beryllium-metals Joints for Application in the Plasma-facing Components", Journal of Nuclear Materials 212-215 (1994) pp. 1604-1607.
Dreizler et al., "Preparation and Properties of P/m [Powder Metallurgy] Copper-beryllium Alloys", Mod. Develop. Powder Met. (1978), vol. date 1974, 7, 505-17 (abstract only).
Eckmann et al., "Diffusion Bonding of Beryllium-copper Alloys", J. Mater. Sci. (1992), 27(1), 49-54, (abstract only).

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