Benzocyclobutene-based die attach adhesive compositions

Details Benzocyclobutene-based die attach adhesive compositions Benzocyclobutene-based die attach adhesive compositions

1987-08-03

1988-07-26

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Free metal containing

252513, 252514, 1563073, 1563311, 156334, 524439, 524440, H01B 104

Patent

active

047598743

ABSTRACT:
The invention is a die attach adhesive composition comprising a homogeneous blend of an organopolysiloxane-bridged bisbenzocyclobutene monomer, an organosilane adhesion aid, and a finely divided electrically conductive metal. The composition is easy to apply, exhibits good adhesive strength and thermal stability at high temperatures, and does not require solvents, initiators, or curing agents. Weight loss on cure is minimal.

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patent: 4466850 (1984-08-01), Eichelberger et al.
patent: 4540763 (1985-09-01), Kirchhoff
patent: 4661193 (1987-04-01), Kirchhoff et al.
Shukla et al., Solid State Technology, 7-85, pp. 67-74.
Bolger, Int. J. Hybrid Microelectronics, 11-82, pp. 496-499.
Estes et al., Proceedings of the 1985 International Symposium on Microelectronics, 11/11-14/85, pp. 391-401.
Bolger, Proceedings of the First Technical Conference on Polyimides, Soc. of Plastics Engineers, (1985), pp. 871-887.
Shappe et al., J. of Adhesion, (1983), pp. 1-38.
Estes, Solid State Technology, 8-84, pp. 191-197.

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