Benzobisazole polymers containing 2,2'-bipyridine-5,5 '-diyl moi

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Nitrogen-containing reactant

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528422, 528337, 528485, 528486, C08G 7306

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active

061144983

ABSTRACT:
An at least semiconductive polymer film is provided by infiltrating novel rigid-rod heterocyclic polymer film containing a 2,2'-bipyridine-5,5'-diyl moiety, with a conductive metal salt. These polymers have repeating units of the formula ##STR1## wherein Z is selected from the group consisting of ##STR2## wherein Q is --H or --C.sub.6 H.sub.5. Alternatively, the metal salt in the semiconductive polymer film can be reduced.

REFERENCES:
patent: 5521277 (1996-05-01), Tan et al.
patent: 5534613 (1996-07-01), Tan et al.
patent: 5536866 (1996-07-01), Tan et al.
patent: 5633337 (1997-05-01), Tan et al.
patent: 5770121 (1998-06-01), Wang et al.
Chem Abstract: 130: 168731 "New aromatic benzazole polymers" Tan et al. 129: 203,332"Synthesis and characterization of Poly (benzo-bisoxazole)s and Poly (benzobisthiazole)s with 2,2'-Bipyridyl units in the backbone" "Yu et al.".
A.H. Gerber, Thermally Stable Polymers Derived from 2,3,5,6-Tetraaminopyridine, Journal of Polymer Science, Polymer Chemistry Edition, vol. 11, 1703-1719 (1973, no month given).

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