Metal deforming – With indication of condition or position of work – product,... – Including deformation by simple bending
Reexamination Certificate
2005-11-01
2005-11-01
Jones, David (Department: 3725)
Metal deforming
With indication of condition or position of work, product,...
Including deformation by simple bending
C072S031100, C072S389300, C072S389600, C072S702000
Reexamination Certificate
active
06959573
ABSTRACT:
A bending apparatus reciprocates at least one of an upper table to which a punch is mounted and a lower table to which a corresponding plurality of adjacent divided dies are mounted. At least one bending angle detector is provided between the dies to detect a bending angle of the workpiece. A main body inserts the bending angle detector into a gap between the dies and withdraws the bending angle detector from the gap between the dies. A lift is biased upward by a first elastic body and is configured to be pressed downward by the workpiece at approximately a center of a groove portion of the dies. The lift includes a first engagement member. A rotor support is biased upward by two second elastic bodies having smaller biasing forces than the first elastic body. The rotor support includes second engagement members. Two rotors are provided on opposite sides of the groove portion at an upper portion of the rotor support. The two rotors include workpiece contacts that contact the workpiece. Links rotatably engage the first engagement member to stop an upper end of the lift in a position lower than an upper surface of the dies, and rotatably engage the second engagement members to position the workpiece contacts below the upper surface of the dies. A bending angle calculator converts rotating amounts of the two rotors into bending angles of the workpiece.
REFERENCES:
patent: 4571834 (1986-02-01), Fraser et al.
patent: 4766675 (1988-08-01), Liu
patent: 4864509 (1989-09-01), Somerville et al.
patent: 5148693 (1992-09-01), Sartorio et al.
patent: 5285668 (1994-02-01), Tokai
patent: 5375340 (1994-12-01), Gerritsen
patent: 5483750 (1996-01-01), Ooenoki et al.
patent: 5584199 (1996-12-01), Sartorio
patent: 5603236 (1997-02-01), Hongo
patent: 6240646 (2001-06-01), Rönnmark et al.
patent: 6266984 (2001-07-01), Gasparini
patent: 6460263 (2002-10-01), Matsumoto
patent: 6571589 (2003-06-01), Ito et al.
patent: 6722181 (2004-04-01), Nagakura
patent: 2001/0009106 (2001-07-01), Gerritsen
patent: 594532 (1994-04-01), None
patent: 63157722 (1988-06-01), None
patent: 2-30327 (1990-01-01), None
patent: 6-238343 (1994-08-01), None
patent: 8-57541 (1996-03-01), None
patent: 10118718 (1998-05-01), None
patent: 10166060 (1998-06-01), None
patent: 10286627 (1998-10-01), None
patent: 2000-140944 (2000-05-01), None
patent: 8105266 (1983-06-01), None
English Language Translation of JP Appln. No. 2-30327.
English Language Translation of JP Appln. No. 63-157722.
English Language Abstract of JP Appln. No. 6-238343.
English Language Abstract of JP Appln. No. 2000-140944.
English Language Abstract of JP Appln. No. 10-118718.
Hatano Ken
Matsumoto Masateru
Takizawa Yutaka
Yanagawa Koichi
Amada Company Limited
Greenblum & Bernstein P.L.C.
Jones David
LandOfFree
Bending method and device therefore does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bending method and device therefore, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bending method and device therefore will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3485363