Bending integrated circuit chips

Details Bending integrated circuit chips Bending integrated circuit chips

1997-01-16

1999-07-13

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29832, 1563069, 524233, 528340, C09J 400

Patent

active

059221674

ABSTRACT:
Disclosed is a method of bonding integrated circuit chips to lead frames where the leads are later soldered. A solution of an adhesive polyimide is used. The polyimide is the reaction product of an aromatic dianhydride and a mixture of an aromatic diamine and an aliphatic diamine.

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patent: 5635010 (1997-06-01), Pepe et al.
Condensed Chemical Dictionary (CCD), p. 857, .COPYRGT.1977.
John A. Kreuz et. al., in Macromolecules (vol. 28, No. 20) Crystalline Homopolyimides and titled Copolyimides etc. (1995).

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