Bellows lid for c4 flip-chip package

Details Bellows lid for c4 flip-chip package Bellows lid for c4 flip-chip package

1992-11-20

1993-10-26

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 165185, 174 163, 257712, 257718, 361703, H05K 720

Patent

active

052571629

ABSTRACT:
An electronic package that has a lid that is in direct contact with an integrated circuit that is mounted to a substrate. The lid includes a plate portion that is in contact with the integrated circuit, an outer frame portion that is attached to the substrate, and a bellows portion that couples the plate portion to the outer frame portion.

REFERENCES:
patent: 5150274 (1992-09-01), Okada et al.

Affiliated with

Also associated with

Rating

Bellows lid for c4 flip-chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bellows lid for c4 flip-chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bellows lid for c4 flip-chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-963606