Bearing assembly for wafer planarization carrier

Abrading – Work holder – Vacuum

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Details

451288, 451289, 451398, 279 3, B24B 704, B24B 2900

Patent

active

057919780

ABSTRACT:
An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member. A detachable pressure plate is connected to the lower plate member by at least one quick release apparatus which utilizes a locking pin secured to the pressure plate and configured to fit through a bore in the lower plate member. In a second embodiment, the upper plate member has recesses in its top and bottom surfaces. The lower plate member includes recesses in its top surface which are aligned with the upper plate member. A plurality of springs held by connecting pins are disposed in the recesses, and a flexure spring is disposed between the upper and lower plate members.

REFERENCES:
patent: 3579917 (1971-05-01), Boettcher et al.
patent: 3731435 (1973-05-01), Boettcher et al.
patent: 4194324 (1980-03-01), Bonora et al.
patent: 4270314 (1981-06-01), Cesna
patent: 5423558 (1995-06-01), Koeth et al.
patent: 5476414 (1995-12-01), Hirose et al.
patent: 5551307 (1996-09-01), Kane et al.
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5624299 (1997-04-01), Shendon

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