Beam lead testing apparatus

Measuring and testing – Ductility or brittleness

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G01N 1904

Patent

active

040559920

ABSTRACT:
An apparatus for testing the bond strength of beam leads is disclosed. The present invention involves testing apparatus that includes a movable table having a probe, a mounting bar adjacent said movable table having a base with an angled surface for mounting microcircuit devices having beam leads and a driving assembly that attaches to said mounting bar for rotating said mounting bar. The device chips are mounted on the mounting bar. The table is positioned towards and under the beam leads extending from the device, the probe on the index table is precisely adjusted to clamp the desired beam lead against the table. The driving assembly is activated to move the mounting bar away from the table until the beam lead is stripped therefrom. A force gage which is attached to the driving assembly measures the force required to strip the beam lead away from the device chip.

REFERENCES:
patent: 3091960 (1963-06-01), Houda, Jr.
patent: 3127766 (1964-04-01), Wolle
patent: 3376736 (1968-04-01), Emery, Jr.
patent: 3564911 (1971-02-01), Slemmons et al.
patent: 3580065 (1971-05-01), Strittmater et al.
patent: 3611795 (1971-10-01), Goldmann et al.

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