Beam lead bonding apparatus

Details Beam lead bonding apparatus Beam lead bonding apparatus

1985-08-02

1987-01-27

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Including compliant cushioning medium

228 41, 228106, 269 21, B23K 3700

Patent

active

046389377

ABSTRACT:
A beam lead bonding apparatus for bonding simultaneously, a plurality of beam leads of varying thicknesses to bonding bumps of varying heights on an integrated circuit substrate subject to cracking when subjected to a predetermined bonding force. The substrate is supported on a base with beam leads in alignment with corresponding ones of the bonding bumps. A resilient pad is provided between the substrate and the base and compressed in response to unequal deflections of the substrate when a bonding element is moved in a direction towards the base to bond the beam leads to the bonding bumps. An alternate compliant pad is disclosed together with an alternate structure for distributing bonding energy throughout the bonding substrate and an alternate arrangement for preventing beam lead to substrate shorts.

REFERENCES:
patent: 3574923 (1971-04-01), Cushman
patent: 3608809 (1971-09-01), Cushman
patent: 3722072 (1973-03-01), Beyerlein
patent: 3804319 (1974-04-01), Piechocki
patent: 3910620 (1975-10-01), Sperry
patent: 3957185 (1976-05-01), Kauffman et al.
patent: 3964666 (1976-06-01), Dinella et al.
Sebonia, R. A., Stress Compensating Fixture for Lead Frame Bonder, Western Electric Technical Digest, No. 52, Oct. 1978, pp. 21 & 22.

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